April 3, 2023
House Energy and Commerce Committee Chair Visits Semiconductor Tech Company
Congresswoman Cathy McMorris Rodgers visits Rohinni Inc. to discuss technology opportunities in the Spokane area
Liberty Lake, Washington – April 3, 2023 – Rohinni, a leading developer of advanced semiconductor placement solutions, announced today a visit from Congresswoman Cathy McMorris Rodgers, U.S. Representative for Washington’s 5th Congressional District, to their Liberty Lake Headquarters.
Congresswoman McMorris Rodgers was given a tour of the 19,000 square foot facility dedicated to creating industry-leading technology for semiconductor device placement and advanced packaging. Rohinni is well-positioned to re-shore semiconductor packaging and explored regional efforts to create a technology hub (Tech Hub) in Eastern Washington with the congresswoman.
“Congresswoman Rodgers is a key part of strengthening our region’s position as a leader in technology and workforce development,” said Ryan Cameron, Rohinni CEO. “We value her expertise and leadership to make the Spokane Region a major player in the re-shoring and securing of the entire semiconductor supply chain here in the U.S.”
“I always encourage people I meet to imagine what’s possible, then go work hard to make it happen. That’s exactly what the brilliant minds at Rohinni are doing right here in Spokane,” said Rodgers. “I was blown away by their incredible cutting-edge technology, including microchips the size of a grain of sand, that bring to life so many of the devices we use today. Their innovative spirit gives me confidence that winning the future starts in Eastern Washington.”
Rohinni currently has plans to hire dozens of new, high-wage technical positions, purchase new hardware, and expand the existing research facility. Rohinni is the only U.S.-based advanced packaging equipment company capable of completing, at scale, the semiconductor supply chain in the United States.
About Rohinni
Rohinni is a leading developer of advanced placement technology by fusing hardware and software to create total customer solutions. Utilizing its patented device-placement technologies, Rohinni enables innovative products to reach the market in high volumes, and at greatly reduced cost. OEMs in markets ranging from consumer to automotive to outdoor signage can incorporate Rohinni’s disruptive technology, yielding products that are brighter, thinner, lighter, lower power and more dynamic than those currently on the market. Rohinni has broad patent coverage for mini and microLED-based technology, robotic placement equipment and manufacturing processes. The company has 167 patent assets in varying stages of prosecution. Investors include Future Shape Principal Tony Fadell, the inventor of the iPod, co-inventor of the iPhone, and founder and former CEO of Nest. For more information, visit www.rohinni.com.
Media Contacts:
Kinzie Ridgewell
press@rohinni.com
August 1, 2022
Rohinni and BOE Strengthen Their Partnership via Placement Solution Agreement
The agreement indicates BOE Pixey’s intent to purchase hundreds of the newly developed Rohinni Advanced MiniLED Placement Systems
Liberty Lake, Washington–August 2, 2022–Rohinni, a leading developer of advanced component placement solutions, today announced its agreement with BOE Pixey, a joint venture between Rohinni and BOE, a global leader in the semiconductor display industry. The agreement outlines the intent to purchase hundreds of Rohinni’s new r/series placement machines to build miniLED display backlight engines and direct emissive displays.
According to Display Supply Chain Consultants (DSCC), by 2025, 1.3 trillion miniLED die will be placed in applications ranging from displays to automotive appliques to consumer electronics. Rohinni’s newly developed placement machine increases efficiency, decreases manufacturing footprint and allows customers to meet the market demands while seamlessly integrating in the current manufacturing environment.
Rohinni’s r/series hardware and Pathfinder productivity software suite enable customers to optimize LED placement throughput for speed and precision. The machine achieves speeds greater than 100Hz with accuracy levels of <10µm. Rohinni’s complete solution achieves a 33% improvement in placement speed, thus requiring 25% fewer machines to meet the projected 2025 demand with 12.6% lower total cost of ownership.
“Rohinni’s placement system sets a new standard for accuracy and throughput. We are excited to deploy their solution in a production environment as Rohinni consistently meets our challenges of advanced display manufacturing,” said Dong Xue, BOE Pixey Chairman. The result of this effort delivers the best possible viewing experiences for our customers. Rohinni is the perfect supplier choice for BOE Pixey as they innovate with us to solve technical issues and work within our standardized manufacturing processes. Using Rohinni’s solution gives us a clear competitive advantage in the advanced display market.”
“We really value our long-standing partnership with BOE Pixey,” commented Ryan Cameron, Rohinni’s CEO. “This agreement signifies a solid commitment from both companies to take display manufacturing to a new level. The miniLED and microLED placement market is growing rapidly and we are committed to capitalize on the leadership Rohinni has established in creating the most advanced placement equipment available. We look forward to making BOE Pixey the leader in advanced displays.”
Justin Wendt, Rohinni CTO reported, “We are excited to launch our newest solution with BOE Pixey. We leverage our process knowledge along with configurable software and proprietary bondheads to deliver the most advanced placement technology in the market. We enable customers to optimize placement throughput and maximize total cost of ownership. As we continue to push the limits on placement technology, customers subscribing to our software updates will see these performance benefits quickly improve line productivity.
Rohinni will be formally announcing its placement equipment solution later this year. For more information see our website (www.rohinni.com).
About Rohinni
Rohinni is a leading developer of advanced placement technology by fusing hardware and software to create total customer solutions. Using its patented device-placement technologies, Rohinni enables innovative products to reach the market in high volumes, and at greatly reduced cost. OEMs in markets ranging from consumer to automotive to outdoor signage can incorporate Rohinni’s disruptive technology, yielding products that are brighter, thinner, lighter, lower power and more dynamic than those currently on the market. Rohinni has broad patent coverage for mini and microLED-based technology, robotic placement equipment and manufacturing processes. The company has 149 patent assets in varying stages of prosecution. Investors include Future Shape Principal Tony Fadell, the inventor of the iPod, co-inventor of the iPhone, and founder and former CEO of Nest. For more information, visit www.rohinni.com.
About BOE
BOE Technology Group Co., Ltd., founded in April 1993, is a global leader in semiconductor display industry as well as an IoT company providing intelligent interface products and professional services for information interaction and human health. BOE’s three core businesses are Interface Devices, Smart IoT Systems, Smart Medicine and Engineering Integration. According to the market data as of 2019 Q3, BOE ranked first in the world in of TFT-LCD panels for mobile phone, tablet, notebook, monitor and TV. BOE also provides integrated total solutions in various industries such as new retail, transportation, finance, education, art, energy, healthcare, etc. BOE boasts a global marketing and R&D centers in 19 countries and regions, with its service networks covering the world’s major areas such as Europe, America, Asia and Africa.
Media Contacts:
Kinzie Ridgewell
press@rohinni.com
Greg Evans, WelComm, Inc
greg@welcomm.com
July 25, 2022
Rohinni Secures Chinese Patent Awards Covering LED Placement Technology
Claims cover proprietary placement solutions needed in the advanced display market to efficiently utilize miniLED technology
Liberty Lake, Washington – July 25, 2022 – Rohinni, a leading developer of advanced component placement solutions, today announced four new Chinese patent claims related to high-speed placement processes have been awarded. The patents cover the company’s newest placement technology which allows for the placement of semiconductor die at speeds greater than 100Hz with accuracy levels of <10µm. The new patents protect Rohinni’s complete solution that achieves a 33% improvement in placement speed, thus requiring 25% fewer machines to meet the projected 2025 demand with 12.6% lower total cost of ownership than leading competitive technology.
The granted claims provide a wide range of protection including the bondhead and needle transfer device, inspection technology and motion control. The awarded claims address the key pillars of Rohinni’s total solution which will be formally introduced later this year.
“miniLED and microLED technology adoption is accelerating at an incredible pace. Rohinni’s demonstrated leadership in high-speed placement technology continues to set new levels of performance so miniLED and microLED technology can be deployed widely, said Justin Wendt, Rohinni’s CTO. “These granted claims provide the protection we need to clearly expand our footprint and leadership position. Our customers, including BOE, have exclusive access to our technology which places them at the forefront of advanced display panel manufacturing technology.”
BOE Pixey, the joint venture between BOE and Rohinni, has access to the new patents as a licensee of the technology.
For more information about the Rohinni’s patent awards in China please see the information below:
CN 110544666: METHOD FOR SEMICONDUCTOR DEVICE TRANSFER
CN 112020765: METHOD AND APPARATUS FOR DIRECTLY TRANSFERRING A PLURALITY OF SEMICONDUCTOR DEVICES
CN 112292756: MULTI-AXIS MOVEMENT FOR TRANSFER OF SEMICONDUCTOR DEVICES
CN 112005362: METHOD AND APPARATUS TO INCREASE TRANSFER SPEED OF SEMICONDUCTOR DEVICES WITH MICRO-
ADJUSTMENT
About Rohinni
Rohinni is a leading developer of advanced placement technology by fusing hardware and software to create total customer solutions. Utilizing its patented device-placement technologies, Rohinni enables innovative products to reach the market in high volumes, and at greatly reduced cost. OEMs in markets ranging from consumer to automotive to outdoor signage can incorporate Rohinni’s disruptive technology, yielding products that are brighter, thinner, lighter, lower power and more dynamic than those currently on the market. Rohinni has broad patent coverage for mini and microLED-based technology, robotic placement equipment and manufacturing processes. The company has 153 patent assets in varying stages of prosecution. Investors include Future Shape Principal Tony Fadell, the inventor of the iPod, co-inventor of the iPhone, and founder and former CEO of Nest. For more information, visit www.rohinni.com.
Media Contacts:
Kinzie Ridgewell
press@rohinni.com
Claire Walker, TechWorks Asia
claire@techworksasia.com